Packaging semiconductor machine parts

Product Name:

Packaging Semiconductor Machine Parts

Advantages:
1) Provide non-standard/standard /OEM/ custom services
2) High precision, tolerance up to 0.005mm
3) Short delivery cycle (5-7 days for samples, 12-15 days for mass production)
4) First use blister box packing, then use wooden case packing, avoid scratches and damage

Product Image:

China Kaili Seiko Technology Co., Ltd. has more than 30 senior technicians engaged in casting, forging and other OEM Mechanical Parts. Equipped with Cnc Machining center, turning, milling, grinding and many other equipments. Suitable for automotive, medical, food, new energy, communication, industrial equipment, aerospace, fixtures and other non-standard mechanical parts. We can also provide our customers with a small amount of diversified and short-cycle products at a high quality and quick response cost. The company always takes "quality, reputation, customer" as the management policy, "customer satisfaction" as the goal, "integrity, quality, efficiency, professional" as the working concept.

Machining Parts Include:

1) Precision machining parts
2) Aluminum precision part
3) stainless steel precision parts
4) Non standard parts as customized
5) Metal Machining parts
6) CNC machining parts
7) Turning parts
8) CNC machined parts
9) Milling parts

Product Description:

Multi-disciplinary integration, high requirements for compound technical talents.


Semiconductor Parts have many kinds, wide coverage, and a long industrial chain. Its R&D, design, manufacturing and application involve the cross-disciplinary and multi-disciplinary integration of materials, machinery, physics, electronics, precision instruments, etc., so there is a great demand for interdisciplinary talents.


Take the electrostatic chuck used to fix the wafer in semiconductor manufacturing as an example, which itself is alumina ceramic or aluminum nitride ceramic as the main material, but at the same time, it is necessary to add other conductive materials to make the overall resistivity meet the functional requirements, which requires a very good understanding of the thermal conductivity, wear resistance and hardness of ceramic materials. In order to meet the semiconductor manufacturing technical indicators of the basic raw materials;


Secondly, the internal organic processing of ceramic structure requires high precision, ceramic layer and metal base to meet the requirements of uniformity and high strength, so for the structure design and processing of electrostatic chuck, the need for precision machining skills and knowledge;


The electrostatic suction cup surface treatment to reach about 0.01 micron coating, at the same time to high temperature resistance, wear resistance, service life is more than three years, therefore, the mastery of surface treatment technology and application requirements are also relatively high. It can be seen that compound and cross technical talents are the basic guarantee of semiconductor parts industry.